High Tg PCBs
Standard PCBs may soften, warp, or lose electrical stability under high temperatures. High Tg PCBs are designed for
better heat resistance and reliable performance in demanding applications.
What is High Tg PCB?
Tg refers to the glass transition temperature of PCB base materials. It shows how well a PCB can resist heat and maintain stability.
- Standard Tg PCB: 130°C–140°C
- Middle Tg PCB: above 150°C
- High Tg PCB: above 170°C, commonly 180°C–225°C
High Tg PCBs use resin systems designed for better heat resistance, lead-free soldering, and stronger mechanical performance. They can help improve PCB reliability under heat, moisture, chemicals, and harsh operating conditions.
ommon high-temperature PCB materials include rigid and flex polyimide, ceramic-filled substrates, and PTFE-based laminates. These high Tg PCB materials are widely used in high temperature PCB applications, rigid PCBs, flex PCBs, industrial electronics, automotive electronics, telecommunications equipment, and other high-reliability PCB designs.
High Tg Rigid PCBs
High Tg materials are commonly used in both rigid PCBs and flex PCBs. A rigid PCB is a solid circuit board that cannot bend or flex during use. High Tg rigid PCBs provide improved heat resistance, mechanical strength, and reliability, making them suitable for industrial electronics, automotive systems, telecommunications equipment, and other high-temperature applications.
Applications for High Tg Rigid PCBs
High Tg rigid PCBs are used in harsh environments where circuit boards must withstand heat, vibration, shock, moisture, and chemical exposure.
Common applications include:
- Automotive electronics
- Aerospace systems
- Industrial control equipment
- Power supplies
- Telecommunications equipment
- defense electronics
High Tg Capabilities for Rigid PCBs
DFYC fabricates and assembles high Tg rigid PCBs using a wide range of high-temperature PCB materials.
| Design & Test | Fine trace width and spacing, IPC Class 2 / IPC Class 3 standards, flying probe test, AOI inspection, impedance control, TDR testing |
| Drill & Route | Laser drilling, blind vias, buried vias, stacked vias, countersinks, counterbores, CNC routing |
| Lamination | 1–32 layers, vacuum lamination, sequential lamination, multilayer PCB stack-up processing |
| Plating | Conductive via fill, non-conductive via fill, plated edges, castellated holes, ENIG, immersion silver, lead-free HASL, OSP |
| Materials | FR-4, high Tg materials, Rogers, Taconic, Isola, Panasonic Megtron, RF and high-speed materials, flex and rigid-flex materials |
Key Design Considerations for High Tg Rigid PCBs
High Tg rigid PCBs should be designed based on the product’s working environment. Heat, vibration, shock, moisture, and mechanical stress can all affect PCB reliability.
Common application requirements include:
- Consumer electronics: shock resistance and stable performance
- Automotive electronics: heat, vibration, and impact resistance
- Aerospace systems: high reliability under temperature changes and micro-vibration
- Industrial equipment: long-term stability in harsh operating conditions
High Tg Flex PCBs
High Tg flex PCBs are designed to fit into compact products or systems that require bending, folding, or flexible installation.
Common flexible circuit types include:
- Flex PCB
- Rigid-flex PCB
- HDI flex PCB
Looking for a High-Frequency PCB Quote?
Send us your Gerber files, BOM, fabrication drawings, stack-up details, material requirements, and quantity. Our engineering team will review your files and check the key technical points, including material selection, impedance control, drilling, fabrication, assembly, and testing needs.
After the review, DFYC will provide a clear quotation and useful technical feedback. This helps you understand the production requirements and move your high-frequency PCB project forward with less risk.
Need More Info?
Contact us to discuss your next PCB project.