PCB Ball Grid Array (BGA) Fabrication &
Assembly Services
What Is a Ball Grid Array (BGA)?
A Ball Grid Array (BGA) is a type of surface-mount package used for integrated circuits and high-performance electronic components. Instead of traditional leads, BGAs use an array of solder balls located on the underside of the package to create electrical connections with the printed circuit board (PCB).
BGA packages are widely used in communication equipment, industrial control systems, automotive electronics, servers, AI hardware, and other applications that require high pin counts, excellent electrical performance, and efficient heat dissipation.
BGA devices are available in a wide range of configurations, from relatively low pin-count packages to advanced devices containing thousands of connection points. The package size, ball count, and pitch are determined during the PCB design stage and directly influence the board layout, routing complexity, layer count, and manufacturing requirements.
As BGA components continue to become smaller and more complex, advanced PCB assembly technologies such as X-ray inspection, AOI inspection, and BGA rework are essential to ensure assembly quality and long-term reliability.
BGA Package Types
BGA components are available in different package types depending on the application, performance requirements, and assembly process.
| Plastic BGA | Commonly used for general electronic products and high-volume PCB assembly. |
| Ceramic BGA | Suitable for applications that require higher thermal performance, durability, or reliability. |
| Tape or Tray Packaging | Smaller BGA components may be supplied on tape or in trays before assembly. |
| Micro BGA | Very small BGA packages that require precise machine placement during assembly. |
| Flip Chip BGA | A package structure where the chip is inverted and connected directly to the substrate instead of using wire bonding. |
Advantages of BGA PCB Packages
BGA packages offer several advantages for modern PCB and PCBA applications, especially where compact size, high performance, and reliable electrical connections are required.
Because the solder balls are arranged underneath the component, BGAs provide more connection points within a smaller space compared with many traditional package types. This makes them suitable for high-density PCB designs, advanced electronic products, and applications with limited board space.
BGA packages can also help improve electrical performance by reducing signal path length and supporting efficient routing on multilayer PCBs. In addition, their pad structure supports stable solder connections when assembled with proper SMT processes and inspected with X-ray equipment.
BGA Fabrication & Assembly Applications
BGAs are widely used in many high-performance PCB and PCBA applications, including:
DFCY Is Your BGA Fabrication and Assembly Partner
DFCY is capable of handling complex PCB and PCBA projects — from PCB manufacturing to assembly — under one roof with advanced production equipment, including SMT assembly lines and selective soldering capabilities.
Our engineering team follows proven best practices for flex and rigid-flex PCB assembly, and our operators understand how to properly handle flexible circuits to help avoid delamination during production. We have experience working with different BGA package types and can support BGA assembly, X-ray inspection, rework, and reballing if customers need to reuse BGA components.
DFCY Assembly Capabilities
Need a Quote?
After receiving your project files, our engineering team reviews the design data, manufacturing requirements, and assembly specifications to ensure an accurate quotation and smooth production process. For most projects, we can provide a detailed quotation within 24 hours after receiving complete information.
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