PCB Ball Grid Array (BGA) Fabrication & Assembly Services

A ball grid array (BGA) is a type of surface-mount package used for integrated circuits. It uses a grid of small solder balls beneath the component to create electrical connections with the PCB.

BGA packages range from fewer than 10 balls to more than 1,700. The number of connections affects PCB routing complexity, layer count, assembly requirements, and inspection methods. Topline Circuit supports BGA assembly for both prototype and production orders.

BGA Package Types

Plastic BGA (PBGA): Uses a plastic substrate and is common in many electronic products.
Ceramic BGA (CBGA): Uses a ceramic substrate for improved thermal performance and dimensional stability.
Micro BGA (µBGA): Features a small package and fine ball pitch, requiring automated placement equipment.
Flip-Chip BGA (FCBGA): Mounts the chip face-down and connects it directly to the substrate instead of using wire bonds.

Depending on the package size and assembly requirements, BGAs may be supplied in trays or tape-and-reel packaging.

Advantages of BGA Packages

BGA packages provide a high number of electrical connections within a compact footprint. Their short connection paths can improve electrical performance and reduce signal inductance. BGAs also use PCB space efficiently and can support better heat transfer. During reflow soldering, surface tension helps the package align with the PCB pads.

BGA PCB Assembly Applications

BGA packages are widely used in electronic products that require high connection density, compact size, and reliable electrical performance. Common applications include:

Aerospace systems
Automotive and autonomous systems
Consumer electronics
Industrial control equipment
Medical devices
Military and defense electronics
Mobile payment devices
Optoelectronic equipment
Semiconductor equipment
Test and measurement systems
Wearable electronics
Wireless communication devices
RF and microwave equipment

Your BGA Assembly Partner

Topline Circuit supports complex PCB projects from layout and fabrication through component assembly. Our team has experience assembling a wide range of BGA packages, including fine-pitch and micro BGA components.We use controlled placement and reflow processes to achieve reliable solder connections. BGA reballing is also available when suitable components need to be reused.

Need a Quote?

We review the design data for every custom PCB and assembly quotation. After receiving your Gerber files, fabrication drawings, schematics, BOM, and other project requirements, our engineering team evaluates the design and prepares a detailed quotation. We respond within 24 hours.