Arlon PCB Materials

Materials

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Arlon Electronic Materials, founded in 1969, manufactures high-performance laminates and prepregs for printed circuit boards. Its materials support PCB designs that require better electrical, thermal, and mechanical performance than standard FR-4.

Arlon’s Material Portfolio

Topline Circuit uses Arlon laminates and prepregs in high-temperature, low-loss, HDI, RF, microwave, and other specialized PCB applications.

Arlon’s portfolio includes:

  • Polyimide laminates and prepregs
  • Low-flow and no-flow prepregs
  • Multifunctional epoxy materials
  • High-Tg epoxy systems
  • Controlled thermal expansion materials
  • Low-loss laminates and prepregs
  • Hole-fill materials
  • PTFE and ceramic-filled materials

These resin systems are available with substrates such as woven glass and nonwoven aramid. Material selection depends on operating temperature, frequency, thermal expansion, loss requirements, lamination process, and PCB construction.

Typical Applications

Arlon electronic materials are used in:

  • Avionics electronics
  • Semiconductor test equipment
  • HDI and microvia PCBs
  • Heat-sink bonding
  • Mobile communication products
  • Industrial electronics
  • High-temperature circuit boards

Arlon RF and microwave materials include PTFE, ceramic-filled PTFE, and low-loss ceramic hydrocarbon thermoset laminates. Typical applications include:

  • Base-station antennas
  • Phased-array radar systems
  • Power-amplifier boards
  • Communication equipment
  • RF and microwave antennas

Arlon CLTE-XT is designed for PCB applications that require low signal loss, controlled thermal expansion, phase stability, and low moisture absorption.

Materials

Polyimide Products

  • 33N Flame-Retardant Polyimide
  • 85N High-Temperature Polyimide
  • 38N Low-Flow Polyimide Prepreg
  • HF-50 Polyimide Hole-Fill Compound
  • 35N Flame-Retardant Polyimide
  • 84N Multifilm Hole-Fill Prepreg
  • 37N Low-Flow Polyimide Prepreg

Epoxy Products

  • 44N Multifilm Hole-Fill Prepreg
  • 47N Low-Flow Tetrafunctional Epoxy
  • 51N Low-Flow Lead-Free Epoxy
  • 45N Multifunctional Epoxy

Legacy Thermount Products

  • 55NT Multifunctional Epoxy/Thermount
  • 55LM Low-Moisture Thermount
  • 85NT Polyimide/Thermount
MATERIAL SUPPORT

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PCB material affects signal performance, heat resistance, mechanical strength, reliability, and cost. Send us your stack-up and design requirements for review.

ThinFlex FCCL material testing for flexible PCB applications

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