Rogers manufactures high-frequency laminates, prepregs, and bonding materials used in RF, microwave, high-speed, and multilayer PCB fabrication.
Topline Circuit supports PCB fabrication using all Rogers material grades. Material selection depends on the operating frequency, signal-loss requirements, PCB stack-up, thermal requirements, and project budget.
PCBs Made With Rogers Materials
Rogers materials may be used for:
- High-frequency PCBs
- RF and microwave PCBs
- Millimeter-wave PCBs
- Controlled impedance PCBs
- Multilayer and hybrid PCBs
- Antenna PCBs
- Automotive radar PCBs
- Satellite communication PCBs
- High-power RF PCBs
Rogers materials provide controlled dielectric properties, low transmission loss, and reliable performance at high frequencies.
Rogers Prepregs and Bonding Materials
- 2929 Bondply Series
- CuClad® Bonding Films
- RO4400™ and RO4400T™ Bondply
- SpeedWave® 300P Prepreg
- COOLSPAN® TECA Film
Topline Circuit can process Rogers laminates, prepregs, bond plies, and hybrid stack-ups. Material availability, cost, and lead time depend on the specified grade, thickness, copper type, quantity, and PCB construction.
Rogers PCB Materials
Commonly specified Rogers material series include: