AGC Multi Material supplies laminates and prepregs for high-speed digital, RF, microwave, and multilayer PCBs.
Its material portfolio includes technologies developed through the former Nelco and Taconic businesses. Topline Circuit supports PCB fabrication using selected AGC materials based on the board design and stack-up requirements.
PCBs Made With AGC Materials
AGC materials may be used for:
- High-speed PCBs
- High-frequency PCBs
- RF PCBs
- Microwave PCBs
- Controlled impedance PCBs
- Multilayer PCBs
- HDI PCBs
- Automotive radar PCBs
- Antenna PCBs
- Communication PCBs
- Server and networking PCBs
- Semiconductor test PCBs
The appropriate material depends on the operating frequency, signal-loss requirements, impedance requirements, board structure, and operating environment.
AGC Materials for PCB Fabrication
AGC provides laminate and prepreg systems for PCB designs that require stable electrical performance, low signal loss, thermal reliability, and multilayer processing.
Material availability and specifications should be confirmed using the current AGC data sheet. Topline Circuit can review the specified AGC material together with the PCB design and stack-up.