TATSUTA develops electronic materials for printed circuit boards and other advanced electronic products. Its product portfolio includes electric wires and cables, EMI shielding films, FFC materials, conductive pastes, bonding wires, sensors, and optical components.for compact, high-performance electronic products.
Topline Circuit uses TATSUTA AE3030 and CBF300 via-fill materials in PCB manufacturing. These copper-based pastes provide high thermal conductivity and help transfer heat through filled vias.
TATSUTA via-fill materials are suitable for PCB designs that require:
- Efficient heat transfer
- Thermal via construction
- Via-hole filling
- Improved thermal management
- Reliable performance in high-heat applications