Qnity (Formerly DuPont) PCB Materials
Materials
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Qnity, formerly DuPont Electronics, develops electronic materials for rigid, flexible, and rigid-flex printed circuit boards. Its portfolio includes polyimide films, copper-clad laminates, coverlays, adhesives, photoresists, and other materials used in advanced PCB fabrication.
Qnity’s Material Portfolio
Topline Circuit uses Qnity materials in rigid, flexible, and rigid-flex PCB manufacturing. Available material types include:
- Polyimide films
- Kapton®, Pyralux®, and Interra® laminates
- Acrylic adhesive systems
- All-polyimide material systems
- Epoxy adhesive systems
- Fluoropolymer adhesive systems
- Thin copper-clad polyimide laminates
- Circuit imaging materials
- Dry-film photoresists
- Screen-printing inks
These materials support PCB designs that require flexibility, thin construction, thermal stability, chemical resistance, or reliable electrical insulation.
Materials for High-Temperature Applications
Qnity offers polyimide materials for flex circuits used in high-temperature environments. Typical applications include:
- Oil and gas equipment
- Automotive electronics
- Aerospace systems
- Defense electronics
- Healthcare equipment
- Industrial control systems
The Pyralux® HT all-polyimide material system is designed for high-temperature flexible circuits. Depending on the PCB construction and operating conditions, it can support applications with temperatures above 250°C (482°F).
Material selection should consider continuous operating temperature, exposure time, copper type, adhesive system, layer count, and required flexibility.
Laminate Materials
Copper-Clad Laminates
- Pyralux® AC Copper-Clad Laminate
- Pyralux® AP Double-Sided Copper-Clad Laminate
- Pyralux® LF Copper-Clad Laminate
- Pyralux® TK Flexible Circuit Material
Coverlay, Bondply & Sheet Adhesive
Need Help Choosing the Right PCB Material?
PCB material affects signal performance, heat resistance, mechanical strength, reliability, and cost. Send us your stack-up and design requirements for review.
